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High scrap rates in sintered gear production due to inconsistent copper powder particle distribution.
Supplied a custom-grade copper powder with tighter particle size distribution (5-15 µm) and improved flowability.
Needed ultra-fine copper powder for high-density interconnect pastes without oxidation during storage.
Developed surface-passivated sub-micron copper powder with 12-month shelf stability under standard conditions.
Zinc-rich primer coatings lacked uniform coverage and had poor adhesion on steel substrates.
Provided lamellar zinc powder with optimized aspect ratio for improved flake alignment and barrier protection.
Required gas-atomized aluminum alloy powder with high sphericity and low oxygen content for SLM printing.
Supplied AlSi10Mg powder via vacuum gas atomization with D50 of 30 µm and oxygen content < 0.08%.